High Density Interconnection (HDI) PCBs include finer structures and smaller vias. The continuing miniaturisation and ever more complex circuits would not be possible without the application of laser-drilled microvias. The microvia technology is necessary for printed circuit boards with a higher packing density. In the case of BGA components with a high number of connections, the vias are located directly within the pads.
Interconnects two layers
Thanks to staggeredly arranged vias, multiple layers can be interconnected.
Connection from layer x to layer x+2 or +3. Here, the inner layers can also be connected, resulting in a higher adhesive strength of the microvias.
Interconnects two layers. Additional advantages compared to standard microvias:
- Higher process reliability at surface finishes
- No soldering problems
- Better electrical and thermal characteristics
Copper-filled stacked microvias
Advantages compared to staggered vias:
- Requires less space
- No problems at the displacement of microvias
- Good adhesion